歡迎報名網路研討會|面向AI基礎設施的光互連未來:邁向下一次速率躍升的關鍵技術

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隨著人工智慧基礎設施不斷擴充套件,以支援大語言模型(LLM)的訓練與推理,對更高速、更具可擴充套件性的光互連解決方案的需求正持續加速。在我們首場網路研討會中,業界專家共同探討了如何更新光纖鏈路標準,以支援100G和200G波特率光訊號傳輸,對應200G/通道和400G/通道的PAM4調製技術——這是建設下一代光互連網路的重要第一步。本次第二場研討會將聚焦於支援400G/通道 PAM4 光訊號傳輸所需的關鍵器件技術,尤其是高速調製器和光探測器的設計挑戰。
我們榮幸邀請到華為伊普斯維奇研究中心 主任工程師陳欣博士擔任本期嘉賓講者。他近期在OFC 2025大會上發表了一篇後期投稿論文,展示了高速整合EML器件的突破性成果。在此次分享中,陳博士將深入解析高速乙太網互連中關鍵III-V族器件(如電吸收調製雷射器EML、光電探測器PD、基於InP的馬赫-曾德爾調製器MZM)的應用與發展趨勢,探討如何透過這些技術創新,推進400G/通道 PAM4 光鏈路的落地,支撐AI和資料中心互連(DCI)網路的發展。
演講嘉賓:陳欣博士,華為伊普斯維奇研究中心 主任工程師
本次研討會為IEEE持續推出的光互聯絡列講座之一,致力於關注行業在AI驅動下不斷演進的光通訊需求,搭建專家對話平臺,共同探索未來技術方向。
時間
北京時間6月10日下午15:00-16:00
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嘉賓介紹
陳欣博士,
華為伊普斯維奇研究中心 主任工程師
演講者:陳欣博士,華為伊普斯維奇研究中心 主任工程師
簡介:陳欣博士現任華為技術研發有限公司英國伊普斯威奇研究中心主任工程師。他于丹麥奧爾堡大學獲得博士學位,曾在學術界任職,包括英國約克大學、曼徹斯特大學、劍橋大學卡文迪許實驗室,並曾在康寧研究中心(Corning Research Center)、CIP以及華為等工業界機構工作。陳博士已發表超過75篇經同行評審的論文,並擁有20餘項專利。他目前的研究重點是面向資料中心互連(DCI)和人工智慧(AI)應用的下一代高速半導體發射器技術
題目:邁向下一代(400G PAM4)光互聯的光子器件
米光燦,
華為主任工程師
主持人:米光燦
簡介:米光燦是華為技術有限公司乙太網實驗室的主任工程師。她於2016年獲得矽光子學與等離子體學博士學位,專注於光互連技術和標準的研究,積累了豐富的行業經驗。她的研究興趣涵蓋從光收發器到光交換技術的各個方面,關注的應用場景則包括資料中心網路和電信/運營商系統。目前,她的工作重點是200G/通道光互連技術和標準的研究。
本次會議是該系列活動的第二場,旨在探討如何利用光互連技術解決智算行業不斷演進的網路頻寬需求,也希望能夠為光互連技術討論和交流提供平臺。
首場內容請見下方連結:
回放: https://pan.baidu.com/s/1TGQEpVDeQUmb–9u19H8HA?pwd=1u9f  Code : 1u9f
PDF:https://cn.ieee.org/wp-content/uploads/Single-Mode-and-Multimode-Fiber-for-Future-Networks.pdf
The Future of Optical Interconnects for AI Infrastructure: Powering the Next Leap to 400G/lane
As AI infrastructure continues to scale in support of training and inference for large language models (LLMs), the demand for faster, more scalable optical interconnect solutions is intensifying. Our first webinar highlighted the industry's push to update fiber link standards—an essential first step in building the next generation of optical interconnects. These updates are necessary to accommodate 100G and 200G Baud PAM4 signaling.
In this second session, we shift the focus from the transmission medium to the key enabling technologies for high-speed signal generation and detection. Specifically, we’ll explore the electro-optic components that make 400G/lane PAM4 signaling feasible and efficient, which is the next major leap in optical interconnect speed.
We are honored to welcome Dr. Xin Chen, Principal Engineer at Huawei UK, as our guest speaker. Dr. Chen recently presented a post-deadline paper at OFC 2025 on record-breaking high-speed electro-absorption modulated lasers (EMLs). In this session, he will share insights into the application and evolution of critical III-V components—such as EMLs, photodiodes (PDs), and InP-based Mach-Zehnder modulators (MZMs)—within high-speed Ethernet interconnects.
Dr. Chen’s presentation will provide a deep dive into the technical advancements and integration strategies needed to support 400G/lane PAM4 optical links, highlighting how these innovations are paving the way for next-generation networks supporting data center interconnect (DCI) and AI workloads.
Speakers:
Guangcan Mi, Principal Engineer, Huawei
Dr. Xin Chen, Principal Engineer, Ipswich Research Center, Huawei Technologies Research & Development Ltd., UK
This session is the second in our ongoing webinar series addressing the industry’s evolving optical networking needs, offering a platform for expert insights and discussions on the technologies that will shape the AI-driven future.
Moderator: Guangcan Mi
Bio: Guangcan Mi is Principal Engineer in Ethernet Lab of Huawei Technologies Co., Ltd. Shereceived her PhD in Silicon Photonic and Plasmonics in 2016. She has since focused her career on optical interconnect technologies and standards. Her expertise spans from optical transceiver to optical switching, for applications of data center networks and telecommunications/carrier systems. Currently her work is concentrated on the development of 200G/lane optical interconnect technologies and standards, with a particular focus on IEEE 802.3df and 802.3dj.   
Speaker : Xin Chen 
Bio: Dr. Xin Chen is a Principal Engineer at Ipswich Research Center, Huawei Technologies Research & Development Ltd., UK. He received Ph.D from Aalborg University, Denmark, and has worked in academia including York University, Manchester University, Cavendish lab, Cambridge University, and in industry including Corning Research Center, CIP, and Huawei. He has published over 75 peer-reviewed papers and holds over 20 patents. His recent work focusses on next generation high-speed semiconductor transmitters for DCI and AI applications. 
Title: The Future of Optical Interconnects for AI Infrastructure: Powering the Next Leap to 400G/lane
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